Recent #data centres news in the semiconductor industry

3 months ago

➀ NVIDIA collaborates with Texas Instruments, Infineon, STMicroelectronics, and others to advance 800Vdc power architecture for AI data centers;

➁ 800Vdc distribution aims to improve power density by 85% and efficiency via dc-dc conversion, supporting future 1MW AI server racks;

➂ The project involves power component leaders like Delta, Schneider Electric, and Navitas to optimize energy infrastructure.

NVIDIATexas Instrumentsdata centres
5 months ago

➀ The dilemma facing Big Tech is the cost of building AI, with estimates ranging from tens of millions to tens of billions;

➁ Some investments in cheap, effective Chinese products have raised concerns about the wisdom of some investments;

➂ Microsoft is withdrawing from data center projects in various countries, and expectations for GenAI are declining due to high failure rates and dissatisfaction with current results;

➃ OpenAI is not yet profitable and expects positive cash flow only in 2029, despite spending $644 billion on AI programs and data centers.

AIGartnerMicrosoftOpenAITechdata centresinvestment
6 months ago

➀ Dell'Oro reported that datacentre capex grew 51% to $455 billion in 2024, driven by hyperscalers deploying accelerated servers optimized for AI training workloads.

➁ The top 10 hyperscalers accounted for over half of global datacentre capex, with NVIDIA's Hopper architecture and custom accelerators from Google, Amazon, and Microsoft contributing significantly.

➂ Dell led all OEMs in server revenue for 2024, with white-box server vendors capturing over 56% of total server revenue.

AIdata centres
10 months ago
➀ Phison Electronics introduces the world's first 128TB PCIe Gen5 SSD aimed at transforming data centre storage; ➁ The Pascari D205V drive offers unparalleled performance and storage efficiency; ➂ The drive is expected to ship in Q2 2025, supporting high-speed data processing and reducing operational expenses.
data centresstorage
11 months ago
➀ The increasing demand for efficient heat dissipation in high-performance devices has led to the emergence of thermal interface materials (TIMs) as essential components in the electronics industry; ➁ TIMs are crucial for enhancing battery performance in electric vehicles, reliability in power electronics, and operational stability in data centres; ➂ The market for TIMs is growing significantly due to advancements in electronics and expanding applications in various sectors.
Thermal Managementdata centreselectronicspower electronics
about 1 year ago
1. Cambridge GaN Devices (CGD) has introduced the new ICeGaN P2 series GaN Power ICs with on-resistance as low as 25 mΩ, targeting high-power applications like data centres and inverters. 2. The ICs support multi kW power levels with high efficiency, featuring advanced packaging and simplified gate driver design. 3. The new series aims to meet the growing demand for energy-efficient solutions in high-density computing and motor control inverters.
Cambridge GaN DevicesICeGaN GaN Power ICsdata centres